MICROCONTAINER FILM TECHNOLOGY FOR DIELECTRICS
We developed microcontainer film technology to produce novel dielectric materials with ULTRA-LOW dielectric constant for cutting-edge electronic applications. It addresses the unprecedented need for ultra-high bandwidth for next-generation computing, advanced telecommunications, and high-speed electronics. Our microcontainer film technology offers a cost-effective and customisable production of novel dielectric materials with Dk close to 1 and excellent mechanical and thermal properties.

TECHNOLOGY FOR FABRICATION OF ULTRA-LOW Dk DIELECTRIC MATERIALS

Our microcontainer film technology offers a cost-effective production of novel dielectric materials with ULTRA-LOW dielectric constant. Due to air saturation, our technology reduces the dielectric constant to close to 1, nearly the same as the air, making our air-saturated microcontainer film a NEW super-structural material.

 

Like Dr Leo Baekeland, who invented Bakelite, the world’s first plastic, we designed air-saturated microcontainer film fabricated from various polymers, such as thermosetting polyimides, or thermoplastic resins, such as epoxy.

 

Our air-saturated microcontainer film is a thermoplastic film formed by an array of regularly spaced air-filled microcontainers. that look like air-filled bubbles of Bubble Wrap, only at a micro- or nanometre scale. The microcontainers of various geometries and sizes are sealed with a cover layer, entrapping air inside. The percentage of air saturation depends on the microcontainers’ size, geometry, wall thickness and spacing, and can reach 90%.

 

Due to the entrapment of air within microcontainers, our air film has almost an ideal dielectric constant, making our dielectric material the best on the market. Increasing the air content leads to a decrease in the Dk, coefficient of thermal expansion and moisture absorption.

Novel low-dielectric material with ultra low dK

EXCEPTIONAL DIELECTRIC CONSTANT OF 1.31-1.5

  • EXCEPTIONALLY LOW DIELECTRIC CONSTANT

    We bring the dielectric constant down to 1.31-1.5, making our air film a material with the best on-the-market dielectric constant.

  • CUSTOMISATION

    Our air film is made from various polymers (PI, PEI, PEEK, resins, etc.). Polymers, microcontainers’ geometry, size, thickness and array density are adjustable to meet the required dielectric, mechanical and thermal properties.

  • FLEXIBILITY

    Microcontainers’ geometry, size, thickness and array are adjustable to meet the required properties. Our air film can also be made rigid or flexible.

  • SCALABLE AND SUSTAINABLE TECHNOLOGY

    Our air film is made from a wide range of stable proprietary water-soluble PI precursors without organic solvents.

  • COMPATIBLE WITH PCB MANUFACTURING

    Our air film sustains high temperature (+220 – +370°С), pressure and mechanical load required for PCB manufacturing and inherits the mechanical strength of PI.

  • REDUCED PRODUCTION COSTS

    Due to air saturation up to 90%, a smaller amount of polymers is required for production, resulting in significant cost reductions.

Microcontainers can be of different geometry – cubical, conical, pyramidal, etc. The size of microcontainers and thickness can vary too to meet the required properties. The size of microcontainers is from submicrons to hundreds of microns, and the array density (spacing between microcontainers) is from a few microns to hundreds of microns.

 

Microcontainers of pre-defined geometry and density are printed with exceptional precision. Due to the controlled printing process, our air film has structural regularity with minimum defects.

Microcontainer film

Air-filled microcontainers can be of various geometries and sizes

AIR-FILLED MICROCONTAINERS AS FILLERS

Polymer materials with embedded air-filled microcontainers can be used for the development of a new generation of ultra-low k dielectric materials.

 

We can fabricate custom-shaped air-filled microcontainers by liberating microcontainers from the air-saturated microcontainer film. These microcontainers can be used as fillers to lower the dielectric constant of materials. As the dielectric constant of air is about 1, increasing the porosity by introducing hollow structures (air-filled microcontainers) and decreasing the density of the material result in a decrease in the dielectric constant of the material.

 

Microcontainers can be of different geometry (cubical, conical, pyramidal, etc.), size and thickness to meet the required properties.

Microcontainers separated from microcontainer film

PRE-INDUSTRIAL PROTOTYPES

Production device for microcontainer film

Prototype of the production device

Novel low-dielectric material

Air-saturated microcontainer film