We developed a unique technology to produce air-saturated microcontainer films from PIs. Having an ultra-low dielectric constant (Dk), our air-films are unique dielectric materials for high-frequency/high-density interconnect PCB. Our material enables the design of next-generation electronics and computing.
We are currently developing materials with an ultra-high Dk and materials with a flexible Dk, where some areas have an ultra-low Dk and some areas have an ultra-high Dk.