We developed a unique technology to produce air-saturated microcontainer films from PIs. Having an ultra-low dielectric constant (Dk), our air-films are unique dielectric materials for high-frequency/high-density interconnect PCB. Our material enables the design of next-generation electronics and computing.
We are currently developing materials with an ultra-high Dk and materials with a flexible Dk, where some areas have an ultra-low Dk and some areas have an ultra-high Dk.
We also developed a new efficient and sustainable technology to produce nanofibre non-woven fabrics and membranes from PIs. Our technology doesn’t require toxic solvents and greatly simplifies the production process.
Our non-woven fabrics offer an ultra-low dielectric constant (Dk), making them excellent as dielectric substrates for high-frequency/high-density interconnect PCBs, radiotelecommunication devices, and energy storage/transfer systems. Our material is not only the perfect dielectric but it can also be used as a filter membrane for the oil & gas industry as well as lithium-ion battery separators.
We developed scalable technology to produce fibre-reinforced foams from PIs. Our technology makes it possible to reinforce the foams with fibres, such as PI, carbon, and glass, to make them highly durable and mechanically strong. Flame, chemical, and radiation-resistant, our reinforced foams are ideal construction and insulation material for extreme conditions.
We developed a very competitive and sustainable technology to produce fibre-reinforced composite materials for additive manufacturing. Due to our unique formulation, our composite materials are much stronger and more durable compared to the existing materials. Replacing metallic and steel structures, they are ideal construction materials for a variety of industries, leading the way in aerospace, automotive and medtech as cutting-edge materials for implants and prostheses.
In addition to their excellent strength, our fibre-reinforced composite materials are remarkably light, twice as light as aluminium. They offer not only strong and durable but also lightweight solutions for applications where weight is important, such as aerospace and drones.
Polyimides (PIs) are among the best-in-the-class plastics due to their exceptional thermal stability, chemical/radiation resistance, durability and mechanical strength. However, there is a trade-off between thermoplastic and thermosetting PIs. While thermosetting PIs demonstrate better physicomechanical properties, they suffer from poor processability, making them incompatible with additive manufacturing and injection moulding. On the other hand, thermoplastic PIs have superior processability, but inferior physicomechanical properties.
We developed our own iPIs, which combine the best properties of thermoplastic and thermosetting PIs. Compatible with additive manufacturing, our thermoplastic semi-crystalline iPIs are unique on the market.
