We are looking for partnerships with manufacturers of advanced materials, high-frequency/high-density interconnect PCBs for high-performance electronics, 5G telecom and aerospace to co-develop and co-promote our material.
BRING THE PERFORMANCE OF ELECTRONIC PRODUCTS TO THE NEXT LEVEL
Energy and signal losses, limited data transmission rate and overheating are common problems with electronics, particularly with ever-increasing data transmission frequencies. Our innovative material solves these problems by reducing the dielectric constant to close to 1.
WE INTRODUCE NOVEL DIELECTRIC MATERIAL WITH EXCEPTIONAL PHYSICO-CHEMICAL PROPERTIES
Printed circuit boards (PCBs) are commonly made of composite materials based on fibreglass and a polymer binder. Despite the low conductivity of PCB, the increasing frequencies of data transmission, such as in 5G, result in significant energy losses, signal loss, limited data transmission rate, and heat dissipation (overheating). Overheating of electronic components is a limiting factor for radio communication systems, high-end computing, data centres, etc. This, in turn, leads to financial losses due to increased expenses on infrastructure.
Our cutting-edge microcontainer film technology solves these problems by reducing the dielectric constant to close to 1, nearly the same as the air, reaching a technological limit for dielectrics. We created a NEW super-structural material.
EXCEPTIONAL DIELECTRIC CONSTANT
Our microcontainer air-film looks like Bubble Wrap at the micro- and nanoscale. It is an air-saturated super-structural thermoplastic film formed by an array of regularly spaced air-filled microcontainers. Due to the controlled printing process, our air-film has structural regularity with minimum defects. Microcontainers of pre-defined geometry and density are printed with exceptional precision.
The microcontainers contain air. Due to the entrapment of air within microcontainers, our air-film has almost an ideal dielectric constant, making our dielectric material the best on the market
Our air-film is an excellent solution for high-frequency/high-density interconnect PCBs for high-frequency telecommunication (5G), data centres, high-performance computing, etc.
WE MAKE THE IMPOSSIBLE POSSIBLE
Energy losses significantly impede the development of high-frequency electronics (supercomputers, data centres, 5G telecom) and make it impossible to design high-frequency consumer electronics. Our technology makes the impossible possible.
Our air-film pushes the technological limits and enables to design next-generation ultra-high-frequency and high-performance computing, data processing and telecom systems.
WIDE RANGE OF POLYMERS
Our air-film can be made from a wide range of polymers (PI, PEI, PEEK, etc.), enabling customisation with respect to dielectric properties, mechanical strength, thermal, chemical, and environmental resistance, and production costs.
RIGID OR FLEXIBLE
By varying the production technology, air-film can be made as rigid as steel or flexible (for wearable electronics).
ABILITY TO SUSTAIN HIGH TEMPERATURES AND HIGH PRESSURE
Our air-film can sustain high temperatures (+220 - +370°С) and high pressures required for PCB manufacturing, and it inherits the mechanical strength of polyimides.
REDUCED PRODUCTION COSTS
The production costs are mainly determined by the price of raw materials (polymers, encapsulated active substances). Our air-film consists of 80% air and only 20% polymer, significantly reducing the production costs as five times less polymers are required.
FLEXIBLE SHAPE, SIZE AND THICKNESS
Microcontainers’ shape, size, thickness and array density are adjustable to meet the required properties. The size of microcontainers can be from submicron to hundreds of microns, and the array density (spacing between microcontainers) can be from a few microns to hundreds of microns.
References:
“Micro-sized “pelmeni” – A universal microencapsulation approach overview” 2021, Materials & Design
“Polyelectrolyte–Graphene Oxide Multilayer Composites for Array of Microchambers which are Mechanically Robust and Responsive to NIR Light” 2018, Macromolecular Rapid Communications
“Patterned Microstructure Fabrication: Polyelectrolyte Complexes vs Polyelectrolyte Multilayers” 2016, Scientific Reports
“Microcontact printing of polyelectrolyte multilayer thin films: Glass–viscous flow transition based effects and hydration methods” 2015, Colloids and Surfaces A
“Micropackaging via layer-by-layer assembly: microcapsules and microchamber arrays” 2014, International Materials Reviews
“Adhesion of Polyelectrolyte Multilayers: Sealing and Transfer of Microchamber Arrays” 2012, Langmuir
“Fabrication and mechanical properties of microchambers made of polyelectrolyte multilayers” 2011, Soft Matter
In total, our team has over 400 scientific publications on patterned microcontainer films and microencapsulation technologies.
PARTNER WITH US
We are looking for partnerships with manufacturers of advanced materials, PCBs for high-performance electronics and telecom to co-develop and co-promote our material. We can help you innovate and bring the performance of your products to the next level.