TAKE ELECTRONICS, COMPUTING AND WIRELESS APPLICATIONS TO THE NEXT LEVEL
We offer unique dielectric materials for high data rate applications – next-generation electronics, computing and future wireless networks, such as 6G and beyond. Not only can you make electronic devices smaller, faster, and more efficient but you can open up a whole new level of connectivity and communication, transforming the way people and objects communicate. We make the impossible possible.

ULTRA LOW DIELECTRIC MATERIALS FOR VERY HIGH DATA RATE APPLICATIONS

UNIQUE DIELECTRICS
NEVER BEFORE WERE DIELECTRICS SO CLOSE TO AIR!

The existing dielectric materials, which have barely changed in half a century, are reaching their limits. For frequencies up to 1GHz, many dielectric materials have been satisfactory in covering the required properties. The problems start with ever-increasing data transfer rates and the development of high-performance compact devices requiring high-density interconnect PCBs. To keep up with this trend and make data transfer faster and more efficient, the industry is actively researching technology that could operate in the terahertz (THz) frequency range. As more and more data are being transmitted wirelessly and electronic devices become smaller and more powerful, the need for low dielectric constant materials increases too.

 

Pushing technological boundaries, our disruptive technology enables the fabrication of novel dielectric materials with an exceptionally low dielectric constant (Dk) to meet the evolving industry requirements in the fields of ultra-high-frequency and ultra-high-speed signal transmission.

AIR-SATURATED MICROCONTAINER FILMS WITH ULTRA-LOW DIELECTRIC CONSTANT

NOVEL DIELECTRIC MATERIAL WITH Dk CLOSE TO 1

We developed a scalable and sustainable microcontainer film technology to produce unique air-saturated microcontainer films. With air saturation up to 90%, our air films have ULTRA-LOW dielectric constant (Dk) of 1.3-1.5 and ULTRA-LOW dissipation factor (Df) of 0.001 @ 1MHz at 25°C reaching a natural limit for dielectrics. With our technology reducing the dielectric constant to close to 1, we created a NEW super-structural material.

 

Our air-saturated microcontainer films can be fabricated from various polymers, such as thermosetting polyimides, or thermoplastic resins, such as epoxy, using accessible, low-cost precursors and enabling customisation with respect to dielectric properties, mechanical strength, thermal, chemical, and environmental resistance, and production costs. The microcontainers can be of various sizes and geometries and have air entrapped inside (air saturation up to 90%). Increasing the proportion of air in microcontainers’ pockets leads to a decrease in Dk, coefficient of thermal expansion and moisture absorption.

Air-saturated microcontainer film with ultra-low dielectric constant

Mechanical properties

Tensile Strength at break: 231 MPa, Tensile Modulus: 2.76 GPa and Tensile Elongation at break: 65%

Thermal properties

Glass Transition Temperature: 360°C, Thermal Decomposition: 550°C and Coefficient of Thermal Expansion: < 20 ppm/K

Hygroscopicity

Moisture Absorption: < 0.2% (at 85% of relative humidity and at the temperature of 85°C)

ULTRA HIGH-DIELECTRIC CONSTANT MATERIALS FOR CAPACITORS

We are currently working on designing microcontainer film dielectric materials with ULTRA-HIGH Dk for applications in capacitors, energy storage electronic devices, microelectronic devices and devices working at high operating frequencies.

DIELECTRIC MATERIALS WITH FLEXIBLE Dk FOR ANTENNA RADOMES

The evolution of high-frequency antennas in telecommunications and navigation satellite systems has created a need for high-performance radomes to shield antennas from their environments (from the impact of wind, rain, snow, sand and solar radiation and reduce the wear, corrosion, aging of the antenna system, and extend its service life) while allowing electromagnetic signals to pass through with minimal attenuation. We are currently working on designing microcontainer film dielectric materials with a FLEXIBLE Dk, where some areas have ultra-low Dk and some areas have ultra-high Dk, for high-performance antenna radome applications that satisfy the above requirements.

NANOFIBRE FILMS WITH ULTRA-LOW DIELECTRIC CONSTANT

NANOFIBRE DIELECTRIC MATERIAL WITH Dk CLOSE TO 1

We developed a cost-effective, scalable and sustainable technology to produce nanofibre non-woven fabrics and membranes from polyimides (PI).
We developed a cost-effective, scalable and sustainable technology to produce nanofibre films with ULTRA-LOW dielectric constant (Dk) of 1.3-1.5 and ULTRA-LOW dissipation factor (Df) of 0.001 @ 1MHz at 25-300°C.

 

Our nanofibre films in the form of non-woven fabrics are fabricated from non-toxic solutions of polyimide prepolymers. Similar to air-saturated microcontainer films, due to air saturation of 70-90%, the dielectric constant of our air-saturated nanofibre films is close to 1.

 

Our nanofibre films are not only ideal dielectric materials for next-generation electronics, computing and wireless systems. They can also be used as filter membranes for the oil & gas industry, as well as lithium-ion battery separators.

Nanofibre dielectric material with ultra-low Dk

Mechanical properties

Tensile Strength at break: 14-22 MPa, Tensile Modulus: 0.135-0.16 GPa and Tensile Elongation at break: 17-26%

Thermal properties

Glass Transition Temperature: 360°C, Thermal Decomposition: 550°C and Coefficient of Thermal Expansion: < 20 ppm/K

Hygroscopicity

Moisture Absorption: < 0.2% (at 85% of relative humidity and at the temperature of 85°C)

PARTNER WITH US

We provide R&D services and seek partnerships with manufacturers of high-performance electronics, computing, wireless communication equipment, high-performance capacitors, radomes and other high-end devices to bring our technologies to the market.