Energy and signal losses, limited data transmission rate and heat dissipation (overheating) are common problems with electronics, particularly with ever-increasing data transmission frequencies. Our innovative material solves these problems by reducing the dielectric constant to close to 1.



We provide lab-to-market services to the manufacturers of high-performance materials, high-frequency/high-density interconnect PCBs for high-performance electronics, 5G telecom and aerospace to satisfy the market demand for increased performance.


Printed circuit boards (PCBs) are commonly made of composite materials based on fibreglass and a polymer binder. Despite the low conductivity of PCB, the increasing frequencies of data transmission, such as in 5G telecom, result in significant energy losses, signal loss, limited data transmission rate, and heat dissipation (overheating). This, in turn, leads to financial losses due to increased expenses on infrastructure.


We reduce the dielectric constant to close to 1, a natural limit for dielectrics


Our innovative material solves these problems by bringing the dielectric constant down to 1.31-1.5.


Our air-films are a breakthrough solution for high-frequency/high-density interconnect PCBs for high-frequency telecommunication (5G), data centres, high-performance computing, etc.


We make the impossible possible


Energy losses significantly impede the development of high-frequency electronics (supercomputers, data centres, 5G telecom) and also make it impossible to design high-frequency consumer electronics.


Our air-film pushes the technological limits and enables the production of next-generation ultra-high-frequency and high-performance computing, data processing and telecom systems.

Our patterned microcontainer air-film is a polymer film with patterned microcontainer air bubbles. It’s like bubble wrap only at the micro-level

Our air-film is produced using our cutting-edge is produced using our cutting-edge microcontainer film technology.


Our air-film is the world’s first material with a dielectric constant close to 1


Due to air saturation, our air-film has almost an ideal dielectric constant (electric permeability), reaching a technological limit for dielectric materials. It reduces the dielectric constant close to 1, nearly the same as the air, making it a NEW super-structural material.


  • We bring the dielectric constant down to 1.31-1.5
  • We bring dielectric loss down to 0.0006


Our air-film provides significant cost reduction


Due to air saturation of up to 80%, less polymers are required resulting in cost savings.


Our micropatterned air-PI can be super rigid or flexible


By varying the production technology, our air-film can be made as rigid as steel or flexible (for wearable electronics).


Our air-film can be made from a wide range of polymers


Our air-film can be produced from a wide range of polymers (PI, PEI, PEEK, etc.), enabling customisation with respect to dielectric properties, mechanical strength, thermal, chemical, and environmental resistance, and production costs.


Our air-film can sustain high temperatures, pressure and mechanical loads


Our air-film can sustain temperatures of +220 – +370°С and pressures required for PCB manufacturing, and it inherits the mechanical strength of polyimides.


Flexible shape, size and thickness


Microcontainers’ shape, size and film thickness are adjustable to meet the required properties, such as stability, structural strength, etc



“Micro-sized “pelmeni” – A universal microencapsulation approach overview” 2021, Materials & Design

“Polyelectrolyte–Graphene Oxide Multilayer Composites for Array of Microchambers which are Mechanically Robust and Responsive to NIR Light” 2018,

Macromolecular Rapid Communications

“Patterned Microstructure Fabrication: Polyelectrolyte Complexes vs Polyelectrolyte Multilayers” 2016, Scientific Reports

“Microcontact printing of polyelectrolyte multilayer thin films: Glass–viscous flow transition based effects and hydration methods” 2015, Colloids and Surfaces A

“Micropackaging via layer-by-layer assembly: microcapsules and microchamber arrays” 2014, International Materials Reviews

“Adhesion of Polyelectrolyte Multilayers: Sealing and Transfer of Microchamber Arrays” 2012, Langmuir

“Fabrication and mechanical properties of microchambers made of polyelectrolyte multilayers” 2011, Soft Matter



Patents and patent applications:


“Array of microcapsules for controlled loading of macromolecules, nanoparticles and other nanoscale items and a method of fabricating it” 2013, US8343773B2

“Core-shell composite material” 2018, US20180344650A1

“Biodegradable multilayer nanocapsules for the delivery of biologically active agents in target cells” 2020, US20200375914A1

“Photosensitive capsules and cosmetic and pharmaceutical use thereof” 2021, US10945963B2


Our team has over 400 scientific publications on patterned microcontainer films and microencapsulation technologies.



Let us know what challenges you are facing, in particular, considering the shift towards 5G and the increasing need to reduce energy losses and overheating in consumer electronics. We will find a solution for you. We can help you improve the performance of your electronic and electric products.