Our air-film is produced using our cutting-edge is produced using our cutting-edge microcontainer film technology.
Our air-film is the world’s first material with a dielectric constant close to 1
Due to air saturation, our air-film has almost an ideal dielectric constant (electric permeability), reaching a technological limit for dielectric materials. It reduces the dielectric constant close to 1, nearly the same as the air, making it a NEW super-structural material.
- We bring the dielectric constant down to 1.31-1.5
- We bring dielectric loss down to 0.0006
Our air-film provides significant cost reduction
Due to air saturation of up to 80%, less polymers are required resulting in cost savings.
Our micropatterned air-PI can be super rigid or flexible
By varying the production technology, our air-film can be made as rigid as steel or flexible (for wearable electronics).
Our air-film can be made from a wide range of polymers
Our air-film can be produced from a wide range of polymers (PI, PEI, PEEK, etc.), enabling customisation with respect to dielectric properties, mechanical strength, thermal, chemical, and environmental resistance, and production costs.
Our air-film can sustain high temperatures, pressure and mechanical loads
Our air-film can sustain temperatures of +220 – +370°С and pressures required for PCB manufacturing, and it inherits the mechanical strength of polyimides.
Flexible shape, size and thickness
Microcontainers’ shape, size and film thickness are adjustable to meet the required properties, such as stability, structural strength, etc